Appeal 2007-0123
Application 10/408,939
filler, and 10-80% melting point component. (Col. 6, l. 61-col. 7, l.
1).
10) McCullough discloses a thermally conductive composite
material that is easily moldable or castable. (Col. 1, ll. 6-8).
11) McCullough discloses using a first thermally conductive
filler having a relatively high aspect ratio of at least 10:1 and a
second thermally conductive filler having a relatively low aspect
ratio of 5:1 or less, in amounts of 25 to 60 vol. % and 10 to 25 vol.
%, respectively. (Col. 2, ll. 25-30).
12) According to McCullough, the low aspect ratio filler fills the
voids between the high aspect ratio filler. As a result, the number
of interfaces and base matrix thickness between filler members is
reduced, thereby providing a thermally composite material having
improved thermal conductivity and performance. (Col. 2, ll. 36-
42).
13) McCullough “preserves the advantages of prior art thermally
conductive plastic compositions” (col. 2, ll. 9-10), which include
“a polymer base matrix loaded with a granular material, such as
boron nitride” (col. 1, ll. 38-39), and exemplifies the same (see,
e.g., Fig. 1, col. 3, ll. 1-3 and col. 3, l. 38 – col. 4, l. 6).
14) McCullough discloses an example in which the high aspect
ratio filler is carbon flakes with an independent thermal
conductivity of 800 W/m-ēK and the low aspect ratio filler is boron
nitride granules with an independent thermal conductivity of 400
W/m-ēK (col. 5, l. 65 –col. 6, l. 5).
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Last modified: September 9, 2013