Ex Parte Miller et al - Page 3

                Appeal 2007-0123                                                                                 
                Application 10/408,939                                                                           
                                                    ISSUE                                                        
                       The Examiner contends that it would have been obvious to modify                           
                Duvall’s composition to include the filler materials disclosed in                                
                McCullough.  Appellants contend that Duvall fails to disclose an elastomer                       
                matrix forming a network in which the phase change material is contained.                        
                The issue for us to decide is:  Has the Examiner shown that Duvall’s                             
                composition inherently possesses the claimed structure?                                          
                       For the reasons discussed below, we answer this question in the                           
                affirmative.  Accordingly, we affirm the Examiner’s rejection of claims 1-                       
                10.                                                                                              
                                 RELEVANT FINDINGS OF FACT (“FF”)                                                

                       1) Duvall discloses a thermal interface material composed of a                            
                          thermally conductive filler and a phase change material.  (Col. 5,                     
                          ll. 29-30).                                                                            
                       2) Duvall indicates that the thermally conductive filler can be a                         
                          mixture and should be “selected from a variety of materials.”  (Col.                   
                          5, ll. 31-36). Suitable thermally conductive filler include “boron                     
                          nitride, aluminum oxide, nickel powder, copper flakes, graphite                        
                          powder, powdered diamond and combinations thereof.”  (Claim                            
                          15).  The bulk conductivity of the mixture of thermally conductive                     
                          fillers should be between 0.5 and 1000 W/m-ēK (col. 5, ll. 36-37).                     
                       3) Duvall states that the particle size distribution and filler                           
                          loading should be selected to maximize packing, thereby                                
                          producing the most efficient thermal conductance.  (Col. 5, ll. 41-                    
                          44).                                                                                   


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