Ex Parte Miller et al - Page 4

                Appeal 2007-0123                                                                                 
                Application 10/408,939                                                                           
                       4) Duvall describes the phase change material as “a mixture of                            
                          two or more compatible components or materials that undergoes a                        
                          reversible solid-liquid phase change at the operating temperature of                   
                          the heating device.”  (Col. 5, ll. 47-50).  Duvall notes that typical                  
                          operating temperature is 50°C to 100ºC.  (Col. 5, ll. 56-57).                          
                       5) The first component of Duvall’s phase change material is a                             
                          polymer component, which may be a single or multi-component                            
                          elastomer consisting of one or more of silicone, acrylic, natural or                   
                          synthetic rubber, or other appropriate elastomeric materials.  (Col.                   
                          5, l. 66-col. 6, l. 4).                                                                
                       6) Duvall’s polymer component “provides the phase change                                  
                          material with body (viscosity) to prevent the melting point                            
                          component and filler from flowing out from between the heat sink                       
                          and the microprocessor heat source.  It thus acts as a viscosity                       
                          controller.”  (Col. 6, ll. 28-32).                                                     
                       7) The second component of Duvall’s phase change material is                              
                          a melting point component which is said to influence the melting                       
                          point of the phase change material in order to achieve a melting                       
                          point at around the operating temperature.  (Col. 6, ll. 12-16).                       
                       8) The viscosity of the melting point component drops as the                              
                          polymer component dissolves in it allowing the material to flow                        
                          and wet adjacent surfaces of a heat sink and microprocessor heat                       
                          source.  (Col. 6, ll. 38-44).                                                          
                       9) In a preferred embodiment, Duvall’s thermal interface                                  
                          material comprises 10-80% polymer, 10-80% thermally conductive                         



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