Appeal 2007-1363
Application 10/637,419
According to Appellants, the invention is directed to a method of
reducing shear stress in a packaged semiconductor chip, including the steps
of providing a semiconductor chip package base having a die attachment
area, providing a die, providing a die attach material, controlling an amount
of the die attach material whereby at least one portion of the die attach
material forms a meniscus on at least one side of the die, with the at least
one meniscus forming at least one die attach fillet upon curing, and the
height of the at least one die attach fillet is thereby controlled to reduce the
shear stress in the die (Br. 2-3). Further details of the invention may be
found in illustrative independent claim 1 which is reproduced below:
1. A method of reducing shear stress in a packaged semiconductor
chip, comprising the steps of:
providing a semiconductor chip package base having a die attachment
area;
providing a die having at least one side and at least one edge,
said die comprising a semiconductor material selected from a
group consisting essentially of silicon (Si), germanium (Ge), and
gallium arsenide (GaAs), and
each said at least one side having a thickness and a width;
providing a die attach material;
controlling an amount of said die attach material disposed between
said die and said semiconductor chip package base,
whereby at least one portion of said die attach material forms at
least one meniscus on said at least one side of the die,
2
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