Appeal 2007-1363
Application 10/637,419
whereby said at least one meniscus forms at least one die attach
fillet upon curing of said die attach material,
thereby controlling at least one height of said at least one die
attach fillet, and thereby reducing shear stress in said die, said at least
one controlled height comprising a range of approximately 0% to
approximately 75% of said at least one die side thickness at a location
of at least 25% inboard from each said at least one edge of any given
at least one die side, and
completing packaging of said semiconductor chip.
The Examiner has relied on the following reference as evidence of
unpatentability:
Raiser US 6,365,441 B1 Apr. 2, 2002
ISSUES ON APPEAL
Claims 1, 3-5, 7-10, 21, and 23-31 stand rejected under 35 U.S.C.
§ 102(e) as anticipated by Raiser (Answer 3).
Claims 2 and 22 stand rejected under 35 U.S.C. § 103(a) as
unpatentable over Raiser (Answer 5).
Appellants contend that Raiser does not teach, disclose, or suggest
controlling an amount of die attach material disposed between a die and a
semiconductor chip package base, thereby controlling at least one height of
at least one fillet, and thus reducing the shear stress in the die (Br. 10).
Appellants contend that Raiser fails to impose any requirements on the
height of fillet 38 and merely exemplifies that fillet 38 may extend from
substrate 14 to a point approximately one-half the thickness of integrated
circuit 12 (Br. 11). Thus Appellants contend that Raiser fails to disclose any
3
Page: Previous 1 2 3 4 5 6 7 8 9 Next
Last modified: September 9, 2013