Appeal 2007-1363
Application 10/637,419
material (underfill) forming a meniscus on at least one side of
integrated circuit 12 (col. 1, ll. 12-13; col. 2, ll. 17-45; Figure 1;
and the Answer 3-4);
(2) Raiser discloses that the liquid die attach material 26 is cured to a
solid state and forms a fillet 38 along the entire perimeter of the
integrated circuit 12, exemplifying fillet 38 extending from the
substrate 14 to a point “approximately one-half” the thickness of
the integrated circuit 12 (col. 1, ll. 39-40; col. 2, ll. 45-50; col. 3,
ll. 48-54; and the Answer 4);
(3) Raiser teaches that, in one embodiment, underfill material may
extend from an outer edge of the integrated circuit 12 towards the
center of the integrated circuit a length L1 that is no less than
approximately 25% of a length L2 between the edges and the
center of the integrated circuit (col. 1, ll. 54-60; col. 2, ll. 59-63;
col. 3, ll. 24-29; Figure 2; and the Answer 4); and
(4) Raiser teaches that when the package is thermally cycled a
mechanical strain may create cracks in the solder bumps 16, and
the use of underfill material 38/26 structurally reinforces the
solder bumps, reducing the strain on the solder bumps 16 and the
corresponding stress, resulting in an improved life and reliability
of the package (col. 1, ll. 27-40; col. 2, ll. 38-40; col. 3, ll. 24-44;
Figures 3a-c; Figures 4a-c; and the Answer 8).
During prosecution before the Examiner, we construe the language of
the claims by the broadest reasonable meaning of the words in their ordinary
usage as they would be understood by one of ordinary skill in the art, taking
into account any enlightenment or definitions found in the specification. See
6
Page: Previous 1 2 3 4 5 6 7 8 9 Next
Last modified: September 9, 2013