Appeal 2007-1862
Application 10/722,652
We affirm-in-part.
As best representative of the disclosed and claimed invention,
independent claims 1 and 20 are reproduced below:
1. An integrated circuit device comprising:
a die having a top surface with a peripheral region and an interior
region surrounded by the peripheral region:
a plurality of bond pads disposed in the peripheral region of the die;
at least one internal bus, disposed in the interior region of the die, that
distributes power to a plurality of internal node points of the die; and
at least one bond wire connecting at least one of the plurality of bond
pads with the at least one internal bus.
20. A method of constructing an integrated circuit device comprising
the following steps:
forming an integrated circuit die having at least one peripheral bond
pad and at least one internal bus, the internal bus being configured for
distributing power to a plurality of internal node points of the integrated
circuit device; and
wire bonding the at least one peripheral bond pad to the at least one
internal bus.
The following references relied on by the Examiner:
Taylor US 6,727,597 B2 Apr. 27, 2004
(Filed December 27, 2001)
Exhibit A Fig 3B of Taylor
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