Appeal 2007-1862
Application 10/722,652
integrated circuit device 300 to be electrically coupled to a package 360 by
either wire bond pads 304 or C4 pads 306 (col. 2, ll. 49-52). The
corresponding bond wire in Figure 3C is not labelled but it is consistent with
the depiction in Figure 1 as well as being well known in the art. Thus,
Taylor only teaches/shows the use of bond wires to connect an integrated
circuit die to its package. Figure 3C also shows related internal metal layers
330 and conduct vias 332, thus permitting the interconnection of these metal
layers to each other and to the respective bonding pads 304, 306.
The Examiner’s reliance upon Figure 3B of Taylor is noted. The
discussion of this figure beginning at the bottom of column 2 through the
bulk of column 3 indicates at column 3, lines 48 through 50 that “the wire
bond power connections 350 are coupled to the C4 power buses 360 along a
metal trace connecting two of the C4 power connections 340.” What the
Examiner illustrates as bond wires in the respective corners of Exhibit A
attached to the Answer are in fact these metal tracings. Therefore, it is
readily apparent to us that the subject matter of independent claims 1 and 20,
respectively requiring “at least one bond wire” and “wire bonding” to
connect one of a plurality of bond pads with at least one internal bus, is not
met by Taylor.
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