Appeal 2007-2916
Application 10/225,502
I. Introduction
This is a decision on appeal under 35 U.S.C. § 134 from the
Examiner's final rejections of claims 1-3, 7 and 10-12, all of the claims
pending in the Application under 35 U.S.C. §§ 112, first paragraph, and
103(a). We have jurisdiction under 35 U.S.C. § 6(b). We AFFIRM-IN-
PART.
The claimed subject matter is directed to thermally conductive
polymer compositions which can be molded into articles which, for
example, dissipate heat from heat-generating devices such as
semiconductors, microprocessors, etc. Claim 1 is illustrative of the subject
matter on appeal:
1. A thermally-conductive molding
composition having an outer flow surface
characterized by reduced abrasive properties, said
composition consisting essentially of:
30% to 50% by volume of a polymer matrix;
25% to 35% by volume of boron nitride, the
boron nitride being in the form of a granular
powder comprising grains having a substantially
hexagonal structure, and
25% to 35% by volume of alumina particles,
said volume of alumina being substantially equal
to said volume of boron nitride, wherein the boron
nitride grains and alumina particles are dispersed
throughout the polymer matrix and said outer flow
surface such that said boron nitride enhances the
lubricity of the outer flow surface and the
composition has a thermal conductivity greater
than 3W/moK. [Br. 18.]
2
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