Appeal 2007-2916
Application 10/225,502
[2] Further according to Appellants' Specification, replacing some of the
alumina filler in the composition with a boron nitride filler is said to
improve the overall thermal conductivity of the composition and to
make it less abrasive (Specification ¶¶ 13, 17).
[3] Appellants' specification describes a thermally-conductive
composition consisting essentially of (a) 30% to 60% by volume of a
polymer matrix, (b) 25% to 60% by volume of boron nitride, and (c)
25% to 60% by volume of alumina, wherein the boron nitride and
alumina are dispersed throughout the matrix (Specification ¶¶ 8, 12-
15).
[4] In one embodiment, the composition consists essentially of 50%
polymer matrix, 25% boron nitride and 25% alumina (Specification
¶ 18).
[5] The thermally-conductive composition preferably has a thermal
conductivity of greater than 3 W/moK, more preferably greater than 22
W/moK (Specification ¶ 8).
[6] The polymer matrix may be a thermoplastic polymer, a thermosetting
polymer or a liquid crystal polymer (Specification ¶¶ 9, 12).
[7] The alumina may be a particle with a relatively high aspect ratio of
10:1 or greater, or a relatively low aspect ratio of 5:1 or less
(Specification ¶ 15).
[8] The boron nitride may be a granular powder, e.g., having a spherical,
flake or hexagonal-like structure, and generally has an aspect (length
to thickness) ratio of 5:1 or less (Specification ¶¶ 9, 14).
[9] According to Appellants' Specification,
boron nitride acts as a flow additive enhancing the
flow of the composite mixture through the molding
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