Ex parte SATOH et al. - Page 8




          Appeal No. 95-2599                                                          
          Application 07/983,931                                                      


          468 U.S. 1228 (1984), citing Kalman v. Kimberly-Clark Corp., 713            
          F.2d 760, 772 218 USPQ 781, 789 (Fed. Cir. 1983).  The prior art            
          disclosure need not be expressed in order to anticipate.                    
          Standard Havens Products Inc. v. Gencor Industries Inc., 953 F.2d           
          1360, 1369, 21 USPQ2d 1321, 1328 (Fed.Cir. 1992).                           
               Under the principles of inherency, we find that Sato teaches           
          "a shaped conductive layer formed by etching ... with the lower             
          portion having a faster etch rate as compared with an etch rate             
          of the upper portion under the same etching conditions” as                  
          recited in Appellants' claim 25.  Sato teaches on page 2 a T-               
          shaped gate electrode is made of a single layer structure                   
          consisting of polycrystalline silicon.  Sato teaches on page 3              
          that the method of manufacture includes a single step, step 2,              
          whereby the T-shape gate electrode is formed by etching such that           
          the width of the gate electrode material is narrower at the lower           
          portion on the substrate side than the upper portion of the gate            
          electrode on the surface side.  On page 9, Sato teaches that the            
          T-shaped gate electrode is a single layer in which physical                 
          qualities or features of the upper portion and the lower portion            
          are different.  Sato teaches some examples of the differences               
          such as  particle shape meaning grain size or the concentration             
          of the impurities.  We note that these differences are the same             

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