Appeal No. 95-2347 Page 6
Application No. 07/928,642
We note that appellants apparently agree with the
examiner's application of Chen to the claimed reactor
structure with the exception, according to appellants, that
Chen does not disclose maintaining the interior surfaces of a
gas manifold at a lower temperature than the temperature of
exterior surfaces of the manifold (brief, page 10). However,
appellants have not specifically pointed out how the claimed
structure, including the "means for circulating fluid...",
patentably differs from the structure of Chen that is being
relied upon by the examiner including the cooling fluid
circulating passageways 20, 22, 56, 66 and 68 described in
column 5 of Chen.
We agree with the examiner's determination that the
claimed and argued functional limitations regarding the
relative temperatures of the gas manifold surfaces do not
serve to patentably distinguish the underlying claimed
structure from that of Chen. Clearly, as suggested by the
examiner, the use of a plasma in the portion of the reactor of
Chen below electrode (12) to etch a wafer, as described by
Chen, would result in a
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