Appeal No. 2000-0949
Application No. 08/721,505
BACKGROUND
The appellant's invention relates to a semiconductor wire bonding method. An
understanding of the invention can be derived from a reading of exemplary claim
14, which is reproduced below.
14. A semiconductor device wire bonding method, comprising:
providing a semiconductor die having a plurality of bond pads thereon connected to
integrated circuits formed on the die;
providing a semiconductor leadframe strip having a plurality of die mounting sites,
each mounting site having an associated arrangement of lead fingers
including tip portions;
attaching the die to the leadframe strip at a mounting site;
bonding a fine bond wire to a bond pad of the die;
determining a width (W) and a longitudinal axis of the tip portion of a selected lead
finger;
locating a bond site on the tip portion of the selected lead finger generally along the
longitudinal axis and spaced from a terminal edge of the selected lead finger
by a predetermined distance; and
bonding the fine bond wire to the selected lead finger substantially at the bond site.
The prior art references of record relied upon by the examiner in rejecting the
appealed claims are:
Holdgrafer 5,119,436 Jun. 02, 1992
Rostoker et al. (Rostoker) 5,404,047 Apr. 04, 1995
(Filed Dec. 18, 1992)
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