Appeal No. 2000-0949
Application No. 08/721,505
providing a semiconductor leadframe strip Holdgrafer teaches the use of the vision
having a plurality of die mounting sites, system for use with dies with a leadframe
each mounting site having an associated strip with associated lead fingers having
arrangement of lead fingers including tip tip portions as shown in figures 1-3.
portions;
attaching the die to the leadframe strip at a Inherent in the production of the chip would
mounting site; have been the connection of the die to the
substrate bearing the leadframe strip.
Alternatively, it would have been obvious to
one of ordinary skill in the art to have
connected the two bodies together prior to
performing wire bonding.
bonding a fine bond wire to a bond pad of Since the vision system of Holdgrafer is
the die; intended to be associated with a wire
bonding apparatus, the wire bonding
apparatus would bond the wire to the die.
(See col. 7, lines 19-32)
determining a width (W) and a longitudinal Holdgrafer discloses the use of
axis of the tip portion of a selected leaddetermining the width of the lead finger
finger; and dividing this width by 2 to determine
the center. (See col.5, lines 29- col. 6,
lines 22.) Holdgrafer does not specifically
disclose the determination of the
longitudinal axis. In our view, it would have
been obvious to a skilled artisan to have
the vision system similarly determine the
longitudinal axis and use it for tracking the
bonding tool. As evidence to support this
position, we rely upon appellant’s own
discussion in the “Background of the
Invention” section.
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