Appeal No. 2000-0949
Application No. 08/721,505
locating a bond site on the tip portion ofHoldgrafer discloses the bonding point to
the selected lead finger generally along the be a predetermined distance from the
longitudinal axis and spaced from a edge, 25 or tip. (See col. 5 lines 54-58
terminal edge of the selected lead finger and figure 3.)
by a predetermined distance; and
bonding the fine bond wire to the selected Since the vision system of Holdgrafer is
lead finger substantially at the bond site.intended to be associate with a wire
bonding apparatus, the wire bonding
apparatus would bond the wire to the lead
finger. (See col. 7, lines 19-32).
Appellant’s specification discloses that determining and using the longitudinal axis of the
lead finger in wire bonding was well known. In the "Background of the Invention" section,
Appellant states:
In general, such vision systems are adapted to sense the lateral
edges of the lead fingers and to teach a bond site in the middle of the lead
finger somewhere along the longitudinal axis of the lead finger. There is,
however, no provision for precisely locating the bond site on a lead finger an
exact distance from the tip of the lead finger. Typically, the bonding tool is
programmed by an operator to move a set distance away from the bond pad
for placing the bond site along the longitudinal axis of a lead finger. This is
not an accurate or consistent method for teaching a bond site location on a
lead finger. In addition, this method of locating a bond site tends to use more
bond wire than is necessary because the length of the bond wire is
consistently oversized.
(Emphasis added.) (See column 1, line 58- col. 2, line 3.)
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