Appeal No. 2000-0949
Application No. 08/721,505
Appellant further states:
For teaching the location of a bond site 20' on a particular lead finger
16', the locations of the lateral edges 22', 24' of the lead finger 16' are
sensed by the vision system of the wire bonding apparatus. The wire
bonding apparatus is then programmed to determine a midpoint between
the edges 22, 24 of the lead finger 16'. This is the dimension "Y" in FIG. 1.
Accordingly, axis 28' is the longitudinal axis of the lead finger 16'. Following
this determination, the bonding tool of the wire bonding apparatus is
programmed to move along the longitudinal axis 28' of the lead finger 16', a
predetermined distance "X" from the appropriate bond pad 18 on the
semiconductor die 10, to locate the bond site 20' and make the bond.
(Emphasis added.) (See column 2, lines 16-29.)
For the tool to move along the longitudinal axis, the axis must have been
determined by the vision system and communicated to the tool. In our view, it would have
been obvious to one of ordinary skill in the art at the time of the invention to have
incorporated the determination and the use of the longitudinal axis of lead fingers into the
tracking system of Holdgrafer to move the predetermined distance D to attach the wire
bond.
We make no finding with respect to the determination of the bonding distance which
is not PRE-determined since this limitation is not in the broadest claims, in our view, which
are claims 5 and 14. In our view, the choice of a predetermined value is a value which may
be chosen by a skilled artisan though routine experimentation whereas a measured and
determined value based upon a measurement or calculation
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