Appeal No. 1997-2164
Application No. 08/277,468
The invention, as Appellants describe on pages 5 and 6 of
the specification, relates to the structure and fabrication of
an electrical feedthrough on a vacuum package enclosure. On
page 5 of Appellants' specification, the vacuum package
enclosure is identified as an enclosure which is meant to be
evacuated. As such, the walls of the vacuum package chamber
and hermetic seal of the feedthrough separate ambient pressure
from the evacuated portion. On page 6 of the specification,
Appellants identify that the feedthrough includes a ceramic
plate which is sized to be received within an aperture in a
wall of the vacuum package enclosure. The ceramic plate has
several holes bored into it which receive cylindrical pins.
Appellants disclose on page 8 of the specification that the
pins are brazed to the ceramic plate and that the ceramic
plate is brazed to the enclosure. Appellants' fabrication
process, described on pages 8 through 12 of the specification,
is such that the assembly is heated once to both braze the
pins to the ceramic plate and braze the ceramic plate to the
vacuum housing. As a result, the electrical feed- through and
vacuum housing are only subjected to the brazing temperatures
once.
2
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Next
Last modified: November 3, 2007