Appeal No. 1997-2164
Application No. 08/277,468
Independent claim 1 is representative of the invention.
1. A method for preparing an electrical feedthrough,
comprising the steps of:
furnishing a ceramic feedthrough plate having a
feedthrough plate thickness;
furnishing a vacuum package enclosure structure which
receives the feedthrough plate therein;
furnishing at least one metallic feedthrough pin having a
length greater than the feedthrough plate thickness;
forming a pin bore through the feedthrough plate for each
feedthrough pin, each pin bore having a pin bore size greater
than that of the feedthrough pin;
inserting each feedthrough pin into its respective pin
bore;
brazing each feedthrough pin into its respective pin bore
utilizing a metallic braze alloy; and
brazing the feedthrough plate to the vacuum package
enclosure structure, the step of brazing the feedthrough plate
to the vacuum package enclosure structure to occur
concurrently with the step of brazing each feedthrough pin
into its respective pin bore.
The Examiner relies upon the following references:
Guillotin et al. (Guillotin) 3,901,772 Aug.
26, 1975
Oeschger et al. (Oeschger) 4,174,145 Nov. 13,
1979 Bowsky et al. (Bowsky) 4,461,925 Jul.
24, 1984 Mizuhara et al. (Mizuhara) 5,368,220
Nov. 29, 1994
(filed Aug. 4, 1992)
3
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