Appeal No. 1998-0096 Application No. 08/518,182 of the opinion that the composite bumps having a circular cross section must be provided on the integrated circuit element prior to bonding together the integrated circuit element and the substrate. We agree with the appellants that Fujimoto does not 12Page: Previous 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 NextLast modified: November 3, 2007