Appeal No. 1998-0096
Application No. 08/518,182
Claim 7 is directed to a method of forming a bonded
structure between an integrated circuit element having
input/output pads and a substrate having substrate
input/output pads, which method comprises, inter alia, the
steps of:
providing a single polymer body [wherein each
single polymer body has a conductive metal coating
thereon which comprises a composite bump] on each
said integrated circuit element input/output pad,
wherein the cross section area of said single
polymer body on each said integrated circuit element
input/output pad has a circular shape and is smaller
than that of each said integrated circuit element
input/output pad;
. . . .
bringing together said integrated circuit
element and said substrate so that said composite
bumps contact said substrate input/output pads and
are deformed during said contact; . . . (emphasis
added).
Fujimoto discloses a method of forming a bonded
structure, comprising the steps of: providing a single polymer
body 24 on each input/output pad 23 of integrated circuit
element 20; providing a conductive metal coating 25 upon the
polymer body and covering the input/output pads, wherein each
polymer body and metal coating comprises composite bump 26;
providing a nonconductive adhesive 28 made of a photocuring
10
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