Appeal No. 1998-0096 Application No. 08/518,182 polymer body on each said integrated circuit element input/output pad and covering each said integrated circuit element input/output pad wherein each said single polymer body and said conductive metal coating comprises a composite bump; 3Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 NextLast modified: November 3, 2007