Appeal No. 1998-0096
Application No. 08/518,182
bringing together said integrated circuit element and
said substrate so that said composite bumps contact said
substrate input/output pads and are deformed during said
contact; and
bonding said composite bumps to said substrate
input/output pads.
The references relied on by the examiner are:2
Kanakarajan et al. 5,298,331 Mar. 29, 1994
(Kanakarajan)
Chun 5,331,235 Jul. 19, 1994
(filed Apr. 10, 1992)
Tsukagoshi et al. (Tsukagoshi) 372 880 Jun. 13, 1990
(European Patent Application)
Fujimoto et al. 3-62927 Mar. 19, 1991
(Fujimoto) (Japanese Patent Application)
Saito et al. (JP4-6841) 4-6841 Jan. 10, 1992
(Japanese Kokai)
Saito et al. (JP4-30532) 4-30532 Feb. 3, 1992
(Japanese Patent Application)
Onozaki 4-151843 May 25, 1992
(Japanese Patent Application)
Claims 7, 8, 11, 15 and 18 stand rejected under 35 U.S.C.
§ 102(b) as being anticipated by Fujimoto or, in the
alternative, under 35 U.S.C. § 103 as being unpatentable over
the combination of Fujimoto and Saito (JP4-6841).
Claims 9, 14, 16 and 17 stand rejected under 35 U.S.C.
§ 103(a) as being unpatentable over Fujimoto as applied to
2Copies of the translations of the Japanese references are
attached.
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