Appeal No. 1998-0096
Application No. 08/518,182
disclose the composite bumps that have a circular shape prior
to the formation of the bonded structure.
Accordingly, it is evident that Fujimoto does not
disclose every limitation of claim 7. Since claims 11, 15 and
18 depend from claim 7, it follows that Fujimoto does not
disclose every limitation of claims 11, 15 and 18. Thus, we
do not sustain the 35 U.S.C. § 102(b) rejection of claims 7,
11 15 and 18.
The 35 U.S.C. § 102(b) Rejection of Claim 8 Based on Fujimoto
Claim 8 is directed to a method of forming a bonded
structure between an integrated circuit element having
input/output pads and a substrate having substrate
input/output pads, which method comprises, inter alia, the
steps of:
providing a single polymer body [wherein each
single polymer body has a conductive metal coating
thereon which comprises a composite bump] on each
said substrate input/output pad, wherein the cross
section area of said single polymer body on each
said substrate input/output pad has a circular shape
and is smaller than that of each said substrate
input/output pad;
. . . .
bringing together said integrated circuit
element and said substrate so that said composite
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