Appeal No. 1998-0096
Application No. 08/518,182
bumps contact said integrated input/output pads and
are deformed during said contact; . . . (emphasis
added).
Appellants have argued that
[i]n Claim 8 composite bumps are formed on the
substrate before the bond is formed and not the
integrated circuit element, as in Fujimoto and Saito
(JP4-6841). . . The composite bumps of Claim 8 have
a circular shape prior to the formation of the
bonded structure while the projecting electrode of
Fujimoto has an essentially square cross section
prior to bonding the semiconductor element to the
wiring board. (Brief, pages 18-19).
The examiner has replied that “[c]ontrary to appellant’s [sic]
assertion otherwise, claim 8 is not limited in scope to a
process wherein the bumps are formed on the substrate before
the bond is formed and not the integrated circuit element, . .
.” (Answer, page 14). Thus, there is a disagreement between
the appellants and the examiner regarding whether claim 8
calls for the composite bumps to be formed on the substrate
before the bond is formed.
In interpreting claim 8, it is our opinion that the
composite bumps having a circular shape must be provided on
the substrate pads before the step of bringing together the
substrate and the integrated circuit element. Fujimoto does
not disclose the composite bumps being provided on the
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