Appeal No. 1998-0096
Application No. 08/518,182
insulating resin between the integrated circuit element 20 and
the substrate 30; and bringing together the integrated circuit
element 20 and the substrate 30, whereby the adhesive 28 is
hardened by the application of light energy 31 and the
composite bumps 26 contact the substrate input/output pads 29
and are deformed (Figures
1-2). Fujimoto further discloses that metal coating 25 is
made of Ti-Pd-Au, i.e, an adhesion layer, a barrier layer and
a conductor layer (Translation, page 11).
The examiner has determined that the cross section area
of the single polymer body of Fujimoto has “a circular shape
and is smaller than each of the pads” (Answer, page 4).
Appellants have not disputed such a determination, but they
have argued that appellants’ composite bumps have “a circular
shape prior to the formation of the bonded structure while the
projecting electrode of Fujimoto has an essentially square
cross section prior to bonding the semiconductor element to
the wiring board" (Brief, page 17).
Pending claims are to be given their broadest reasonable
interpretations. In re Zletz, 893 F.2d 319, 321, 13 USPQ2d
1320, 1322 (Fed. Cir. 1989). In interpreting claim 7, we are
11
Page: Previous 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Next
Last modified: November 3, 2007