Ex parte CHANG et al. - Page 15




          Appeal No. 1998-0096                                                        
          Application No. 08/518,182                                                  


          substrate pads; rather, Fujimoto discloses the composite bumps              
          on IC element pads.  Moreover, Fujimoto’s composite bumps do                
          not have a circular cross section prior to bonding together                 
          the integrated circuit element and the substrate.                           






























                                         15                                           





Page:  Previous  8  9  10  11  12  13  14  15  16  17  18  19  20  21  22  Next 

Last modified: November 3, 2007