Appeal No. 1998-0096
Application No. 08/518,182
amendment that preceded the final rejection, claim 19 was
canceled (paper number 17). Accordingly, claims 7 through 18,
21 through 27, and 29 through 33 remain before us on appeal.
The disclosed invention relates to a method of forming a
bonded structure between input/output pads on an integrated
circuit element and input/output pads on a substrate. The
bonded structure includes composite bumps comprising a polymer
body and a conductive metal coating surrounding the polymer
body which provide physical and electrical connections between
the integrated circuit element input/output pads and the
substrate input/output pads.
Claim 7 is illustrative of the claimed invention, and it
reads as follows:
7. A method of forming a bonded structure, comprising:
providing an integrated circuit element with integrated
circuit element input/output pads;
providing a substrate with substrate input/output pads;
providing a single polymer body on each said integrated
circuit element input/output pad, wherein the cross section
area of said single polymer body on each said integrated
circuit element input/output pad has a circular shape and is
smaller than that of each said integrated circuit element
input/output pad;
providing a conductive metal coating upon said single
2
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