Appeal No. 1998-0341
Application No. 08/476,293
(e) an inorganic passivating layer deposited on the
sidewalls of said via where said via passes through
said organic-containing dielectric; and
(f) an electrical connection formed by filling said
via with a conducting material, said electrical
connection being connected to one of said patterned
conductors, whereby connection can be made to a
second level of patterned conductors deposited
above the inorganic dielectric layer.
The Examiner relies on the following references:
Balda et al. (Balda) 4,523,372 Jun. 18, 1985
Page et al. (Page) 5,284,801 Feb. 8, 1994
Kokkotakis EP 0 177 845 Apr. 16, 1986
(published European Patent Office Application)
?Lithographic Patterns with a Barrier Liner,” 32 IBM Technical
Disclosure Bulletin, no. 10B, 114-115, (March 1990) (IBM).
Claims 11 through 14 and 16 through 18 stand rejected
under 35 U.S.C. § 103(a) as being unpatentable over Kokkotakis
and IBM in view of Balda.
Claim 15 stands rejected under 35 U.S.C. § 103(a) as
being unpatentable over Kokkotakis, IBM and Balda, and further
in view of Page.
Rather than reiterate the arguments of Appellant and the
Examiner, reference is made to the brief and answer for the
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