Appeal No. 2000-0806
Application No. 09/016,398
that thermal stresses on the two bases in response to
temperature changes are substantially equal.
Upon a careful review of Dordi and Selna, we fail to
find any suggestion or reason to modify Dordi to use the
printed circuit board of Selna as the "carrier base" of
Appellant's invention. We agree with the Examiner that Dordi
teaches a semiconductor chip (12) having a plurality of
connection pads, surrounded by a resin layer (36). Dordi
teaches that the chip is mounted on a thin tape (16, 16')
rather than a printed circuit board or carrier base; Dordi
further teaches a plurality of conductors (24, Fig. 1) that
penetrate through the tape to an opposite surface, where each
conductor connects to a spherical shaped connection terminal
(26). Contrary to the assertions of both the Examiner and
Appellant, Dordi explicitly teaches, within the detailed
description of his invention, a stiffener (34) having a
coefficient of thermal expansion (CTE) matching the
coefficient of thermal expansion of the printed circuit board
(32)(col. 5, lines 7-10). The difficulty in relying on Dordi,
from the Examiner's point of view, is that if tape 16 is
15
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