Appeal No. 2000-0806
Application No. 09/016,398
desired vias. In the absence of evidence suggesting why the
skilled artisan would have found it obvious to modify the
invention of Dordi, having a PCB with no vias or connection
terminals on its lower surface, to include such vias and
connection terminals, we will not sustain the rejection of
claims 1-11, 13, 21, and 22 under 35 U.S.C. § 103.
Appellant's claim 23 recites a ball grid array
semiconductor integrated circuit device, including many
limitations very similar to those contained in claim 1: a
semiconductor chip, plurality of conductors, plurality of
external connection terminals, a sealing resin layer
surrounding the chip, a carrier base to which the chip is
mounted, and a reinforcement base. The notable differences
between claim 1 and claim 23 are that (a) the semiconductor
chip is not mounted centrally between the carrier base and
reinforcement base, and (b) rather than having matching
coefficients of thermal expansion, the two bases have
differences in at least one of modulus of elasticity and
thickness, so that thermal stresses on the two bases in
response to temperature changes are
17
Page: Previous 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Next
Last modified: November 3, 2007