Appeal No. 2000-0806
Application No. 09/016,398
31 increases the available electrode pattern area, with
improved inductance characteristics (column 8, lines 8-13).
Yamashita teaches that the heat release member is meant to
radiate excess heat away from the semiconductor chip and
associated wiring (column 9, lines 18-23). Yamashita does not
teach or suggest that thermal stresses on the printed circuit
board and any "reinforcement base" are of concern, or that the
modulus of elasticity or thickness of either board or base
should be varied in order to make those stresses substantially
equal. Even if we assume that Yamashita provided the
intermediate plate and/or heat release member with a modulus
of elasticity or thickness different from its printed circuit
board, for the purpose of equalizing thermal stresses, the
Examiner has presented no suggestion from the art of record as
to why it would have been obvious to modify the Dordi
invention, with its two bases having equal coefficients of
thermal expansion, to use the "unequal" bases of Yamashita.
As noted supra, Dordi teaches a carrier base and
reinforcement base having equal coefficients of thermal
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