Appeal No. 2000-0806
Application No. 09/016,398
substantially equal (notably, the same goal expressed in claim
1, and solved by matching CTEs).
The Examiner relies on a combination of Dordi,
Selna, and Yamashita to arrive at the invention recited in
claim 23. To meet the limitations first presented in claim 23
(chip location, base characteristics), the Examiner asserts
that Yamashita teaches non-central location of the
semiconductor chip, and two bases having different
thicknesses, concluding that Yamashita "show a device which is
simpler to fabricate than the Dordi device and it would have
been obvious to employ it." We agree with the Examiner that
Yamashita teaches, in two of its embodiments, an "intermediate
plate 31" and a "heat release member 41" located at roughly
the same spot as the reinforcement base of the instant
invention; we further agree that the semiconductor chip 12 of
Yamashita is not located centrally between printed circuit
base 11 and the opposing plate/member. Yamashita, however,
does not teach varying the modulus or thickness in order to
equalize thermal stresses on the carrier base and
reinforcement base. Yamashita teaches that intermediate plate
18
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