Appeal No. 2000-0806
Application No. 09/016,398
noted supra, the semiconductor chip and associated connection
pads and conductors; the carrier base (32); and the
reinforcement base (34), the two bases being substantially the
same size (see Fig. 6). Dordi teaches a first and second
insulating adhesive layer (the sealing resin layer 36 below
and above the semiconductor chip, respectively), the
reinforcement base adhered to the semiconductor chip by the
second insulating layer. Neither Dordi nor Selna, however,
teach or suggest that the carrier base and reinforcement base
have substantially the same size as the semiconductor chip.
The Examiner argues that Dordi teaches this element, and
points to Figure 6 for support of his position. As noted
supra, Figure 6 does illustrate that stiffener 34, which
corresponds to the reinforcement base of the instant
invention, has substantially the same dimensions as tape 16,
on which semiconductor chip 12 is mounted. Carrier base 32 is
not illustrated in Figure 6; Dordi implies but does not
explicitly teach that the carrier base has substantially the
same size as the reinforcement base, by explaining that solder
balls 26 align with and may be soldered to appropriate pads on
12
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