Appeal No. 2000-0806
Application No. 09/016,398
electrically connected to a corresponding one of the
connection pads;
a plurality of external connection terminals, each
connection terminal having a spherical shape and
corresponding, respectively, to a corresponding one of the
conductors;
a first insulating adhesive layer;
a second insulating adhesive layer;
a carrier base adhered to the semiconductor chip by
the first insulating adhesive layer; and
a reinforcement base adhered to the semiconductor
chip by the second insulating adhesive layer, wherein the
semiconductor chip, the first insulating adhesive layer, and
the second insulating adhesive layer form a core material, the
carrier base and the reinforcement base have substantially the
same size as the semiconductor chip and are skin materials,
sandwiching the core material, the connections of the
conductors to the connection pads are located at a first
surface of the carrier base, the conductors are located in the
carrier base, and
the external connection terminals are located at a second
surface of the carrier base opposite the first surface.
23. A ball grid array semiconductor integrated circuit
device comprising:
a semiconductor chip having a plurality of
connection pads;
a plurality of conductors, each conductor being
electrically connected to a corresponding one of the
connection pads;
a plurality of external connection terminals, each
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