Appeal No. 2000-0806
Application No. 09/016,398
device comprising:
a semiconductor chip having a plurality of
connection pads;
a carrier base having a first surface to which the
semiconductor chip is mounted;
a plurality of conductors, each conductor being
electrically connected to a corresponding one of the
connection pads; the conductors penetrating through the
carrier base from the first surface to an opposite, second
surface of the carrier base;
a plurality of external connection terminals, each
external connection terminal having a spherical shape, being
disposed on the second surface of the carrier base, and being
electrically connected to a corresponding one of the
conductors;
a sealing resin layer surrounding a periphery of the
semiconductor chip; and
a reinforcement base, wherein the semiconductor chip
and the sealing resin layer form a core material, the carrier
base and the reinforcement base are skin materials sandwiching
the core material, the semiconductor chip is located centrally
between the carrier base and the reinforcement base, and the
carrier base and the reinforcement base have the same
coefficient of thermal expansion whereby thermal stresses in
the carrier base and the reinforcement base in response to
temperature changes are substantially equal.
14. A semiconductor integrated circuit device
comprising:
a semiconductor chip having a plurality of
connection pads;
a plurality of conductors, each conductor being
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