Appeal No. 2000-0806
Application No. 09/016,398
external connection terminal having a spherical shape and
being electrically connected to a corresponding one of to the
conductors;
a sealing resin layer surrounding a periphery of the
semiconductor chip;
a carrier base having a first surface to which the
semiconductor chip is mounted; and
a reinforcement base, wherein the semiconductor chip
and the sealing resin layer form a core material, the carrier
base and the reinforcement base are skin materials sandwiching
the core material, the conductors being located at least
partly in the carrier base, the external connection terminals
being located at a second surface, opposite the first surface,
of the carrier base, the semiconductor chip is not located
centrally between the carrier base and the reinforcement base,
and the carrier base and the reinforcement base have
differences in at least one of modulus of elasticity and
thickness so that, as a result of the differences, thermal
stresses in the carrier base and the reinforcement base in
response to temperature changes are substantially equal.
The Examiner relies on the following references:
Selna 5,640,048 Jun. 17,
1997
Suzuki 5,650,918 Jul. 22,
1997
Yamashita et al. (Yamashita) 5,726,493 Mar.
10, 1998
Dordi 5,835,355 Nov. 10,
1998
Claims 1, 4, 9-11, 13, 14, 16, 17, and 19-22 stand
rejected under 35 U.S.C. § 103 as being unpatentable over
6
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