Appeal No. 2000-0806
Application No. 09/016,398
14, lines 18-23).
In a further embodiment of the invention, the
carrier base and reinforcement base have substantially the
same size as the semiconductor chip (Specification, page 23,
line 19 to page 25, line 3).
In a further embodiment of the invention, the
semiconductor chip is not centrally located between the
carrier base and the reinforcement base (Specification, page
20, lines 6-10), and the two bases have differences in at
least one of modulus of elasticity and thickness
(Specification, page 21, line 14 to page 22, line 11) such
that, as a result, thermal stresses in the carrier base and
the reinforcement base in response to temperature changes are
substantially equal.
Independent claims 1, 14, and 23 are reproduced as
follows:
1. A ball grid array semiconductor integrated circuit
3
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