Appeal No. 2000-0806
Application No. 09/016,398
on the opposite side of the printed circuit board for making
connections; and that while the Selna reference does teach a
printed circuit board having vias and opposite-mounted solder
balls, no basis is suggested by the Examiner for combining the
two references. Appellant further asserts that neither Dordi
nor
Selna teaches a carrier base and reinforcement base having the
same coefficient of thermal expansion; while admitting that
Dordi discloses such a concept in its discussion of the prior
art, Appellant asserts that there is no support in Dordi for
the proposition that matching coefficients of thermal
expansion of materials on opposite sides of a semiconductor
chip in a ball grid array package is known or suggested in the
prior art. Appellant further asserts that there is no element
in Dordi that corresponds to the carrier base claimed, and
that there is no element in Selna that corresponds to the
reinforcement base. Further, Appellant asserts, even assuming
the combination of Dordi and Selna teaches every element of
the claimed invention, the person having ordinary skill in the
art would not have found it obvious to make the combination
advanced by the Examiner.
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