Appeal No. 1999-1131
Application No. 08/754,758
("Specification"), page 1, lines 6-10. Specification, page 5,
line 35 to page 6, line 3. The principle of the invention
aims to provide signal lines (control-signal lines and data-
signal lines), other than power-signal lines, in a simple
wiring layout using a small number of wiring layers.
Specification, page 8, lines 5-9. Specifically, the
semiconductor device arrangement includes control signal pins
arranged on a first side, data-input/output pins arranged on a
second side substantially perpendicular to the first side, and
power-input pins provided on arbitrary sides of the
semiconductor device. Specification, page 5, line 35 to page
6, line 3. In this manner, the pin arrangement according to
the principle of the present invention can provide connections
between semiconductor devices by using a small number of
wiring layers and a simple wiring layout. Specification, page
8, lines 12-16. Since there is no branch stemming from the
control-signal lines, signal reflections can be avoided to
achieve high speed data transmission using high-frequency
signals. Specification, page 8, lines 16-19.
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