Appeal No. 1999-1131
Application No. 08/754,758
Appellants' independent claims encapsulate the various
embodiments of the invention. Independent appealed claims 1,
10, 14 and 18 are herein respectively recited:
1. A semiconductor device connected to one or more
semiconductor devices of the same type, said semiconductor
device comprising:
first pins for receiving signals commonly used with said
one or more semiconductor devices; and
second pins for being connected to signal lines which are
not connected to said one or more semiconductor devices,
wherein all of said first pins are provided on a first
side of said semiconductor device and all of said second pins
are provided on a second side of said semiconductor device
substantially perpendicular to said first side, said first
pins and said second pins excluding pins for receiving power
voltages.
10. A semiconductor device comprising:
a semiconductor chip;
a package housing said semiconductor chip;
first pins for receiving control signals for controlling
said semiconductor chip; and
second pins for inputting data to and outputting data
from said semiconductor chip,
wherein all of said first pins are provided on a first
side of said package and all of said second pins are provided
on a second side of said package substantially perpendicular
to said first side, said first pins and said second pins
excluding pins for receiving power voltages.
3
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