Appeal No. 1999-1131
Application No. 08/754,758
semiconductor packages connected to said second signal
lines to share said second signal lines;
third signal lines provided on said second board to
extend in a second direction substantially perpendicular to
said first direction, said third signal lines being provided
separately for each of said semiconductor packages; and
node portions provided at an end of said second signal
lines and said third signal lines and arranged in a line on
one side of said second board to be connected to said first
signal lines,
wherein each of said semiconductor packages comprises:
first pins connected to said second signal lines; and
second pins connected to said third signal lines,
wherein all of said first pins are provided on a first
side of each of said semiconductor packages and all of said
second pins are provided on a second side of each of said
semiconductor packages substantially perpendicular to said
first side, said first pins and said second pins excluding
pins for receiving power voltages.
In rejecting Appellants' claims, the Examiner relies on
multiple references:
Murai 4,586,162 Apr. 29,
1986
Takeda et al. (Takeda) 5,319,591 Jun. 7,
1994
Werther 5,513,076 Apr. 30,
1996
Michael 5,572,457 Nov. 5,
1996
Claims 1-3, 6, 9 and 14-17 stand rejected under 35 U.S.C.
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