Ex Parte DING et al - Page 9



         Appeal No. 2001-2544                                                       
         Application No. 08/995,108                                                 
         an interconnect, use in a contact via structure would have been            
         obvious, given the teaching of general applicability, and to               
         connections with via structures (column 6, lines 51 et seq.).              
              Finally, a thickness change to adapt a product to an end use          
         does not render the claimed subject matter unobvious.  It is not           
         inventive to discover optimum or workable ranges by routine                
         experimentation, and appellants have the burden of proving any             
         criticality.  In re Boesch, 617 F.2d 272, 276, 205 USPQ 215, 218-          
         19 (CCPA 1980); In re Aller, 220 F.2d 454, 456, 105 USPQ 233, 235          
         (CCPA 1955).  We are therefore not persuaded by this argument.             
           The Rejection of Claims 8-17 and 21-26 Under 35 U.S.C. §103(a)           
              The examiner has found that Hoshino teaches a sputter                 
         deposited first layer, a second layer of Ta deposited thereon and          
         a physical vapor deposition of copper over the barrier layer.              
         Landers is said to teach a Ta/TaN barrier combination is well              
         known and desired, therefore, it would have been obvious to                
         modify Hoshino to include the Ta/TaN layer of Landers.                     
         (Examiner’s Answer, page 5, lines 3-20).                                   
              The appellants argue that Hoshino’s layers are the reverse            
         of their claimed order.  (Appeal Brief, page 13, lines 3—20).  We          
         note that the embodiment disclosed at Hoshino, column 3, lines             
         20-column 4, line 14 results in a structure from top to bottom             
         of:                                                                        
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