Ex Parte DING et al - Page 11



         Appeal No. 2001-2544                                                       
         Application No. 08/995,108                                                 
         therefore reverse this rejection.                                          
            The Rejection of Claims 18-20 and 27 Under 35 U.S.C. §103(a)            
              Claims 18-20 and 27 stand rejected under 35 U.S.C. §103(a)            
         as being unpatentable over Hoshino in view of Landers for claims           
         8-17, and further in view of Ngan.                                         
              As we have reversed the underlying rejection of claims 8-17,          
         we likewise reverse this rejection for the same reasons.                   
               The Rejection of Claims 18-20 Under 35 U.S.C. §103(a)                
              Claims 18-20 stand rejected under 35 U.S.C. §103(a) as being          
         unpatentable over Gelatos in view of Landers for claims 8-17, and          
         further in view of Ngan.                                                   
              The examiner has found that Ngan teaches that in the                  
         manufacture of semiconductor devices, ion deposition sputtering            
         is preferred over traditional sputtering in order to have uniform          
         step coverage and filling of contact hole vias.  Ngan utilized             
         ion deposition sputtering to deposit an equivalent set of layers,          
         titanium and titanium nitride; therefore, the examiner concludes,          
         it would have been obvious to further modify Gelato’s invention            
         by using ion-deposition sputtering because Ngan teaches ion                
         deposition sputtering improves deposition in semiconductor                 
         manufacturing. (Examiner’s Answer, page 6, line 18 – page 7,               
         line 6).                                                                   
              The appellants urge that ion deposition sputtering is a               
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