Appeal No. 2002-2118 Page 10 Application No. 09/010,614 The auxiliary legs 9 may be formed in a number of manners. It may be formed by bending a selected extension 9 which is segregated from and punched out of the main engagement leg 6 (Figure 7). When formed, the lateral distance between the outer surfaces 9b of the opposite auxiliary legs 9 is equal to the lateral distance U (Figure 6) between the inner surfaces 4b of the connector sidewalls 4. In order to facilitate the insertion of the connector sidewalls 4 into the intervening space 12, each auxiliary leg 9 may be equipped with an inwardly-bent end 9a which reduces the likelihood of snagging the placement cover auxiliary support legs 9 on the inner surfaces 4b of the connector sidewalls 4. Ikesugi teaches (column 5, line 65, to column 6, line 20) that [i]n use, the placement cover 1 is attached to an electric connector 2 by pushing it against the top of the electric connector 2 until the main engagement legs 6 ride down the connector sidewall outer surface 4a until their gripping portions 112 effectively catch in the sidewall recesses 4c. Simultaneously, the auxiliary engagement legs 9 ride down along the connector sidewall surface 4b until the sidewall 4 is effectively sandwiched therebetween. The cover plate 8 thereupon lies upon the connector insertion slot 10 of the connector 2. Inasmuch as the auxiliary support legs 9 extend along the interior 4b of the connector sidewalls 4, each such sidewall 4 is thereby supported by the engagement legs 9 against the forces applied by the main engagement legs 6 of the collector placement cover 1. When carrying the electric connector 2 to a printed circuit board, the placement member 1 is picked up applying a negative pressure to the flat top surface 7 of the placement cover 1, and then the placement cover-connector assembly is transferred to the printed circuit board 100. Then, the connector-board assembly are passed through a reflow vessel, in which solderPage: Previous 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 NextLast modified: November 3, 2007