Appeal No. 1999-1066
Application No. 08/756,440
APPENDIX
21. A negative photosensitive resin composition which comprises an acid
generating compound for generating an acid by light irradiation and at least
one polyimide precursor selected from the group consisting of (a) a silicon-
containing polyimide precursor obtained from (1) A mols of a derivative of a
tetracarboxylic dianhydride formed by reacting 1 or 2 mols of a monovalent
saturated alcohol having 1 to 7 carbon atoms with 1 mol of the tetracarboxylic
dianhydride, (2) B mols of a diamine and (3) C mols of an aminosilicon
compound represented by the formula (1)
1
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