Appeal No. 1999-1066 Application No. 08/756,440 APPENDIX 21. A negative photosensitive resin composition which comprises an acid generating compound for generating an acid by light irradiation and at least one polyimide precursor selected from the group consisting of (a) a silicon- containing polyimide precursor obtained from (1) A mols of a derivative of a tetracarboxylic dianhydride formed by reacting 1 or 2 mols of a monovalent saturated alcohol having 1 to 7 carbon atoms with 1 mol of the tetracarboxylic dianhydride, (2) B mols of a diamine and (3) C mols of an aminosilicon compound represented by the formula (1) 1Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 13 14 NextLast modified: November 3, 2007