Ex Parte MAEDA et al - Page 10





            Appeal No. 1999-1066                                                                       
            Application No. 08/756,440                                                                 

                                               APPENDIX                                                
                  21. A negative photosensitive resin composition which comprises an acid              
            generating compound for generating an acid by light irradiation and at least               
            one polyimide precursor selected from the group consisting of (a) a silicon-               
            containing polyimide precursor obtained from (1) A mols of a derivative of a               
            tetracarboxylic dianhydride formed by reacting 1 or 2 mols of a monovalent                 
            saturated alcohol having 1 to 7 carbon atoms with 1 mol of the tetracarboxylic             
            dianhydride, (2) B mols of a diamine and (3) C mols of an aminosilicon                     
            compound represented by the formula (1)                                                    




































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