The opinion in support of the decision being entered today was not written
for publication and is not binding precedent of the Board.
Paper No. 18
UNITED STATES PATENT AND TRADEMARK OFFICE
____________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
____________
Ex parte SHIGENOBU MAEDA
____________
Appeal No. 2003-1310
Application No. 09/761,7381
____________
HEARD: JANUARY 20, 2004
____________
Before FLEMING, BARRY, and SAADAT, Administrative Patent Judges.
SAADAT, Administrative Patent Judge.
DECISION ON APPEAL AND ORDER
This is a decision on appeal from the Examiner’s final
rejection of claims 21-24. Claims 1-20 have been cancelled.
We affirm.
BACKGROUND
Appellant’s invention is directed to a manufacturing method
of semiconductor wafers for improving adaptability to the
1 Application for patent filed January 18, 2001, which is a divisional
of the Application No. 09/349,514, filed July 9, 1999, now U.S. Patent No.
6,231,673, which claims the foreign filing priority benefit under 35 U.S.C.
§ 119 of Japanese Application No. P11-14303, filed January 22, 1999.
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