Ex Parte Maeda - Page 1




            The opinion in support of the decision being entered today was not written 
                   for publication and is not binding precedent of the Board.          

                                                                  Paper No. 18         

                       UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                      ____________                                     
                           BEFORE THE BOARD OF PATENT APPEALS                          
                                   AND INTERFERENCES                                   
                                      ____________                                     
                                Ex parte SHIGENOBU MAEDA                               
                                      ____________                                     
                                  Appeal No. 2003-1310                                 
                              Application No. 09/761,7381                              
                                      ____________                                     
                                HEARD: JANUARY 20, 2004                                
                                      ____________                                     
          Before FLEMING, BARRY, and SAADAT, Administrative Patent Judges.             
          SAADAT, Administrative Patent Judge.                                         



                              DECISION ON APPEAL AND ORDER                             
               This is a decision on appeal from the Examiner’s final                  
          rejection of claims 21-24.  Claims 1-20 have been cancelled.                 
               We affirm.                                                              
                                      BACKGROUND                                       
               Appellant’s invention is directed to a manufacturing method             
          of semiconductor wafers for improving adaptability to the                    


               1  Application for patent filed January 18, 2001, which is a divisional 
          of the Application No. 09/349,514, filed July 9, 1999, now U.S. Patent No.   
          6,231,673, which claims the foreign filing priority benefit under 35 U.S.C.  
          § 119 of Japanese Application No. P11-14303, filed January 22, 1999.         





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