Ex Parte Maeda - Page 3




          Appeal No. 2003-1310                                                         
          Application No. 09/761,738                                                   

               Claims 21-24 stand rejected under the second paragraph of               
          35 U.S.C. § 112 as being indefinite.                                         
               Claims 21-24 stand rejected under 35 U.S.C. § 102(b) as                 
          being anticipated by Krolikowsky.                                            
               Rather than reiterate the viewpoints of the Examiner and                
          Appellant regarding the rejections, we make reference to the                 
          answer (Paper No. 11, mailed August 30, 2002) for the Examiner’s             
          reasoning and to the appeal brief (Paper No. 10, filed July 22,              
          2002) and the reply brief (Paper No. 13, filed October 24, 2002)             
          for Appellant’s arguments thereagainst.                                      
                                       OPINION                                         
               With respect to the rejection of the claims under the second            
          paragraph of 35 U.S.C. § 112, the Examiner questions the clarity             
          and the meaning of the term “intellectual property” as “circuit              
          components” (answer, page 3).  Appellant argues that the use of              
          the term “intellectual property” as predefined circuits that can             
          be formed on a semiconductor wafer as a component of a larger                
          operational circuit are known in the industry (brief, page 4).               
          Appellant further provides copies of web-page printouts to                   
          support the use of the term “intellectual property” in this                  
          context as used in semiconductor manufacturing art (brief,                   
          Appendix II).                                                                

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