Appeal No. 2004-0748 Page 2
Application No. 09/427,226
BACKGROUND
The appellants' invention relates generally to methods and devices for increasing
the density of integrated circuits (IC's) placed on a substrate such as a printed circuit
board (PCB), and more particularly to methods and devices for stacking chips
comprising surface mount technology (SMT) chip packages (specification, p. 1). A copy
of the claims under appeal is set forth in the appendix to the appellants' brief.
The prior art references of record relied upon by the examiner in rejecting the
appealed claims are:
Burns 5,484,959 Jan. 16, 1996
Buechele 5,768,772 June 23, 1998
Hacke 6,157541 Dec. 5, 2000
Farnworth 6,168,969 Jan. 2, 2001
Claims 1, 2, 11 and 12 stand rejected under 35 U.S.C. § 102(e) as being
anticipated by Buechele.
Claims 3 to 5 and 15 stand rejected under 35 U.S.C. § 102(e) as being
anticipated by Hacke.
Claims 6, 7 and 16 stand rejected under 35 U.S.C. § 103 as being unpatentable
over Farnworth in view of Burns.
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