Appeal No. 2004-0748 Page 11
Application No. 09/427,226
in the stack. Several exemplary programmable blown or open fuse elements 260a,
260b and 260c are also depicted, such open fuse elements isolating a die above a
certain level from a particular via stack. Thus, for example, a chip-select via for the
base dice 210h may be isolated from the remaining seven (7) die above it. Other vias
may similarly be isolated. Programmable antifuses may similarly be employed to
selectively connect, rather than disconnect, conductors on and between dice. Several
programmable activated or closed fuse elements are depicted at 264a, 264b, and 264c.
Fuses and antifuses may, of course, be employed in combination on the same die and
on adjacent dice.
Burns' invention relates to forming an improved package particularly suited for
multiple-unit three-dimensional stacking. This improved package is fabricated by
attaching a lead frame to an integrated circuit package in a manner that results in
improved thermal transfer of heat from within the integrated circuit package and
provides additional electrical conductors useful with addressing and communicating
multiple package modules. Figure 20 relied upon by the examiner is an embodiment
having four thin small outline package (TSOP) integrated circuit packages 22 stacked
together and electrically and thermally interconnected through rails 70. Packages 22
are laminated to lead frames 27 and then the lead frames 27 are connected to the rails
70 by soldering, thermal compression bonding or any other suitable means.
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