Appeal No. 2004-0748 Page 5
Application No. 09/427,226
Buechele describes his invention with reference to an apparatus and preferred
lamina transport mechanisms therein for automating a larger portion of the process for
assembly of multi-layer ceramic (MLC) or other modular circuit packages. The
apparatus includes a stacking/removal mechanism 100, a pin stacking assembly 120
and a floating stack head 130. As illustrated in Figure 4, three complete groups of
lamina 302 have been stacked, separated and covered by separator plates 303 and
mylar sheets 301. At this point, the entire pin stacking assembly 120 with the stacked
lamina thereon can be removed from a mounting plate 118 of the stacking/removal
mechanism 100 and transferred to a warm frame for establishing a uniform temperature
for lamination and, in due course, to a lamination press and oven for lamination. After
lamination, the lamina stack is removed from the pin stacking assembly 120.
The appellants argue (brief, pp. 3-4) that the limitation "each layer comprising at
least one chip" is not met by Buechele. We agree. The appellants have defined
(specification, p. 8) ''chip'' as "a package containing at least one die, the package having
external contacts electrically coupled to at least some of electrically operative contacts
of the at least one die." Thus, the IEEE definition applied by the examiner (final
rejection, p. 5) cannot be used in this application. We have fully reviewed Buechele but
fail to find any disclosure therein that the lamina 302 contain a "chip" as defined by the
appellants. Accordingly, claims 1 and 2 are not anticipated by Buechele.
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